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 HI-SINCERITY
MICROELECTRONICS CORP.
Spec. No. : HE6232-B Issued Date : 1998.01.09 Revised Date : 2000.09.15 Page No. : 1/3
H2N6426
NPN EPITAXIAL PLANAR TRANSISTOR
Description
Darlington Transistor
Absolute Maximum Ratings
* Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature ................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ............................................................................... 625 mW * Maximum Voltages and Currents (Ta=25C) BVCEO Collector to Emitter Voltage................................................................................... 40 V BVCBO Collector to Base Voltage ...................................................................................... 40 V BVEBO Emitter to Base Voltage ......................................................................................... 12 V IC Collector Current ....................................................................................................... 500 mA
Characteristics (Ta=25C)
Symbol BVCEO BVCBO BVEBO ICEO ICBO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat) VBE(on) *hFE1 *hFE2 *hFE3 Cob Min. 40 40 12 20 30 20 Typ. 0.71 0.9 1.52 1.24 5.4 Max. 1.0 50 50 1.2 1.5 2.0 1.75 200 300 200 7.0 Unit V V V uA nA nA V V V V K K K pF Test Conditions IC=10mA, IB=0 IC=100uA, IE=0 IE=10uA, IC=0 VEB=25V, IB=0 VCB=30V, IE=0 VEB=10V, IC=0 IC=50mA, IB=0.5mA IC=500mA, IB=0.5mA IC=500mA, IB=0.5mA VCE=5V, IC=50mA VCE=5V, IC=10mA VCE=5V, IC=100mA VCE=5V, IC=500mA VCB=10V, f=1MHz
*Pulse Test : Pulse Width 380us, Duty Cycle2%
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
Characteristics Curve
Current Gain & Collector Current
100k 10000
Spec. No. : HE6232-B Issued Date : 1998.01.09 Revised Date : 2000.09.15 Page No. : 2/3
Saturation Voltage & Collector Current
hFE @ VCE=5V
Saturation Voltage (mV)
VBE(sat) @ IC=1000IB 1000 VCE(sat) @ IC=1000IB VCE(sat) @ IC=100IB
hFE
10k
1k 1 10 100 1000
100 1 10 100 1000
Collector Current (mA)
Collector Current (mA)
On Voltage & Collector Current
10000 100
Capacitance & Reverse-Biased Voltage
On Voltage (mV)
VBE(on) @ VCE=5V 1000
Capacitance (pF)
10 Cob
100 1 10 100 1000
1 0.1 1 10 100
Collector Current (mA)
Reverse-Biased Voltage (V)
Safe Operating Area
10000 PT=1ms PT=100ms 600 700
PD-Ta
Collector Current-IC (mA)
1000
PT=1s
Power Dissipation-PD(mW)
500 400 300 200 100
100
10
1 1 10 100
0 0 20 40 60 80 100
o
120
140
160
Forward Voltage-VCE (V)
Ambient Temperature-Ta( C)
HSMC Product Specification
HI-SINCERITY
MICROELECTRONICS CORP.
TO-92 Dimension
A B
12 3
Spec. No. : HE6232-B Issued Date : 1998.01.09 Revised Date : 2000.09.15 Page No. : 3/3
2
Marking :
HSMC Logo Part Number Date Code Rank Product Series
3
Laser Mark
HSMC Logo Product Series
C
D
Part Number
H I E F
G
Ink Mark Style : Pin 1.Emitter 2.Base 3.Collector
1
3-Lead TO-92 Plastic Package HSMC Package Code : A
*:Typical
DIM A B C D E F
Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480
Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76
DIM G H I 1 2 3
Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5 *2 *2
Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5 *2 *2
Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996.
2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.
Material :
* Lead : 42 Alloy ; solder plating * Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0
Important Notice:
* All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.
Head Office And Factory :
* Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 * Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 * Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220
HSMC Product Specification


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